Please note that the content of this book primarily consists of articles available from Wikipedia or other free sources online. Pages: 41. Chapters: Heat sink, Computer cooling, Heat pipe, Thermal management of electronic devices and systems, Water cooling, Computer fan, Thermal grease, Underclocking, Arctic Silver, Thermosiphon, Fan control, Laptop cooler, Loop heat pipe, Air cooling, Arctic Cooling, Water block, Deepcool, Thermally Advantaged Chassis, CPU shim, H2Ceramic cooling, Platform Environment Control Interface, Chassis Air Guide, T-Line, Fusion block system, Thermalright, Tip-Magnetic Driving. Excerpt: A heat sink is a term for a component or assembly that transfers heat generated within a solid material to a fluid medium, such as air or a liquid. Examples of heat sinks are the heat exchangers used in refrigeration and air conditioning systems and the radiator (also a heat exchanger) in a car. Heat sinks also help to cool electronic and optoelectronic devices, such as higher-power lasers and light emitting diodes (LEDs). A heat sink is physically designed to increase the surface area in contact with the cooling fluid surrounding it, such as the air. Approach air velocity, choice of material, fin (or other protrusion) design and surface treatment are some of the design factors which influence the thermal resistance, i.e. thermal performance, of a heat sink. One engineering application of heat sinks is in the thermal management of electronics, often computer central processing unit (CPU) or graphics processors. For these, heat sink attachment methods and thermal interface materials also influence the eventual junction or die temperature of the processor(s). Thermal adhesive (also known as thermal grease) is added to the base of the heatsink to help its thermal performance. Theoretical, experimental and numerical methods can be used to determine a heat sink's thermal performance. A heat sink is an object that transfers thermal energy from a higher tempera...